LTM4605
APPLICATIONS INFORMATION
No Heat Sink
12
10
8
6
4
2
0
Power loss includes all external components
BGA Heat Sink
12
10
8
6
4
2
0
35
45
55 65 75 85 95
105
35
45
55 65 75 85 95
105
AMBIENT TEMPERATURE (°C)
20V IN TO 12V OUT WITH 0LFM
20V IN TO 12V OUT WITH 200LFM
AMBIENT TEMPERATURE (°C)
20V IN TO 12V OUT WITH 0LFM
20V IN TO 12V OUT WITH 200LFM
20V IN TO 12V OUT WITH 400LFM
4605 F11
20V IN TO 12V OUT WITH 400LFM
4605 F12
Figure 11. 20V IN to 12V OUT without Heat Sink
Table 4. 5V Output
Figure 12. 20V IN to 12V OUT with Heat Sink
DERATING CURVE
Figure 7, 9
Figure 7, 9
Figure 7, 9
Figure 8, 10
Figure 8, 10
Figure 8, 10
V IN (V)
12, 16
12, 16
12, 16
12, 16
12, 16
12, 16
POWER LOSS CURVE
Figure 5
Figure 5
Figure 5
Figure 5
Figure 5
Figure 5
AIR FLOW (LFM)
0
200
400
0
200
400
HEAT SINK
None
None
None
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
θ JA (°C/W)*
11.2
8.3
7.2
10.7
7.7
6.6
Table 5. 20V Input and 12V Output
DERATING CURVE
Figure 11
Figure 11
Figure 11
Figure 12
Figure 12
Figure 12
V IN (V)
20
20
20
20
20
20
POWER LOSS CURVE
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
AIR FLOW (LFM)
0
200
400
0
200
400
HEAT SINK
None
None
None
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
θ JA (°C/W)*
8.2
5.8
5.3
7.6
5.3
4.8
HEAT SINK MANUFACTURER
Wake?eld Engineering
PART NUMBER
LTN20069
PHONE NUMBER
603-635-2600
*The results of thermal resistance from junction to ambient θ JA are based on the demo board of DC1198A. Thus, the maximum temperature on board is
treated as the junction temperature (which is in the μModule for most cases) and the power losses from all components are counted for calculations. It has
to be mentioned that poor board design may increase the θ JA .
4605fc
18
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